Return-Path: Received: (qmail 77060 invoked from network); 9 Jul 2004 07:45:33 -0000 Received: from unknown (HELO ptb-spamcore01.plus.net) (192.168.71.1) by ptb-mailstore01.plus.net with SMTP; 9 Jul 2004 07:45:33 -0000 Received: from [192.168.67.2] (helo=ptb-mxcore02.plus.net) by ptb-spamcore01.plus.net with esmtp (Exim 4.32; FreeBSD) id 1Biq4z-000B2j-EH for dave@picks.force9.co.uk; Fri, 09 Jul 2004 08:45:57 +0100 Received: from post.thorcom.com ([193.82.116.20]) by ptb-mxcore02.plus.net with esmtp (Exim) id 1Biq4Y-000Hjj-WB for dave@picks.force9.co.uk; Fri, 09 Jul 2004 07:45:31 +0000 Received: from majordom by post.thorcom.com with local (Exim 4.14) id 1Biq3i-0000V4-Lr for rs_out_1@blacksheep.org; Fri, 09 Jul 2004 08:44:38 +0100 Received: from [213.232.95.59] (helo=relay.salmark.net) by post.thorcom.com with esmtp (Exim 4.14) id 1Biq3i-0000Uv-5K for rsgb_lf_group@blacksheep.org; Fri, 09 Jul 2004 08:44:38 +0100 Received: from one.surfree.co.uk ([195.80.0.234]) by relay.salmark.net with esmtp (Exim 4.24) id 1Biwdp-0005O5-Fx for rsgb_lf_group@blacksheep.org; Fri, 09 Jul 2004 15:46:21 +0100 Received: from standalone ([212.248.140.34]) by one.surfree.co.uk (8.9.3/8.9.3) with SMTP id JAA15328 for ; Fri, 9 Jul 2004 09:42:34 +0100 Received: by localhost with Microsoft MAPI; Fri, 9 Jul 2004 08:41:33 +0100 Message-ID: <01C46590.89F27200.actalbot@southsurf.com> From: Andy To: "'rsgb_lf_group@blacksheep.org'" Date: Fri, 9 Jul 2004 08:41:28 +0100 Importance: high X-Priority: 1 (Highest) Organization: UKNWN(UK) X-Mailer: Microsoft Internet E-mail/MAPI - 8.0.0.4211 MIME-Version: 1.0 X-Spam-Score: 0.6 (/) X-Spam-Report: autolearn=no,RCVD_IN_SORBS=0.1,X_PRIORITY_HIGH=0.516 Subject: LF: RE: Re: Tin Plating compound (off topic LF, almost on topic microwaves) Content-Type: text/plain; charset=us-ascii; format=flowed Content-Transfer-Encoding: 8bit X-Spam-Checker-Version: SpamAssassin 2.63 (2004-01-11) on post.thorcom.com X-Spam-Status: No, hits=0.5 required=5.0 tests=X_PRIORITY_HIGH autolearn=no version=2.63 X-SA-Exim-Scanned: Yes Sender: owner-rsgb_lf_group@blacksheep.org Precedence: bulk Reply-To: rsgb_lf_group@blacksheep.org X-Listname: rsgb_lf_group X-SA-Exim-Rcpt-To: rs_out_1@blacksheep.org X-SA-Exim-Scanned: No; SAEximRunCond expanded to false X-Spam-Filtered: by PlusNet SpamCORE (v3.00) Ok Thanks Alan. I'll make up a solution in that proportion and give it a try. Being able to tin plate home made PCBs may solve the not too major problem of them becoming oxidised and not so nice to look at a few days after construction - though after all the joints have been made fortunately. I have been using the bubble etch tank for some time, in the garage then utility room, and have seen no adverse effects from a fine FeCl3 mist - it is the vertical sort. I only tend to do little boards, (SMT components for everything these days, they're much easier to use). I have noticed a certain difference in etch rate between top and bottom, but its so quick when hot and the FeCl3 is fresh that its hardly important. The copper on normal PCB material is only 3.5microns, so that is quite an extra deposition. Andy 'JNT Hi Andy an old paper RS cat gives some information, though it would seem there is no data sheet. It says..... Deposition rates of tin to tin 1.5 microns in the first half hour, and up to 3 to 4 microns in 2 hours, can be achieved at an optimum room temperature. 5 lites of solution may be made by disolving the pack (450gms) in 5 lites of solution (note not 5 litres of water) at 50 deg C. This is enough for 2.7 sq m of board ( I suppose they mean copper) I think that is probably the information you want. I think we used to call this "electroless tin-plate" I remember using something like it for putting temporary electrodes on silicon slices. We used a photo-electrolytic polishing system, the electrolyte was hydrofluoric acid and glycerine....now there is something really nasty. For etching dont use a bubble etcher, they are terribly messy and distribute a fine, almost aerosol, spray of ferric chloride everywhere, which you dont notice for about 2 days after which clothing and furniture starts to fall apart. If they are the vertical type they also tend to etch unevenly...top to bottom so you have the rotate the board halfway though...messy. I prefer a ice cream carton (they even have a little bulge in the middle of the base to stop the board "ringing" down) with just enough fresh etch to cover the board warmed to about 40 deg C by immersing in a bath of hot water, and steady gentle rocking agitation..... about 5 to 7 mins a board. Tiring but worth the effort. Once used etch kept for the more crude projects, where you can just leave it and not worry about undercutting fine lines. Disposal (important these days) is easy, neutralise the used etch with garden lime (very cheap). It is actually safe to bury then I believe....probably good for reducing earth resistance and better for the soil that common salt. Cheers de Alan G3NYK alan.melia@btinternet.com ----- Original Message ----- From: "Andy Talbot" To: ; Sent: 08 July 2004 18:01 Subject: LF: Tin Plating compound (off topic LF, almost on topic microwaves)