Message-ID: <33120287.957636135540.JavaMail.imail@bubbles.excite.com>
Date: Sat, 6 May 2000 11:02:15 -0700 (PDT)
From: "john sexton" <computernetworks@excite.com>
To: rsgb_lf_group@blacksheep.org
Subject: Re: LF: My TS850
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Hi Dave,
What about telling us how to do it - I refer to 64 pin Surface Mount
Devices?
I found it a real struggle to solder in an 8-pin DDS SMD but did improve
with practice (killed the first one!). One of the most important things I
found was the need to use a 0.1 mm bit on the soldering iron. Anything
bigger just won't do. The special reels of solder are very expensive too.
The handbook/radcom don't tell us the secrets of success. So please any
hints would be welcome, since it is clear that components are all going to
get a lot smaller.

John, G4CNN


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