Return-Path: Received: (qmail 50857 invoked from network); 9 Jul 2004 10:28:42 -0000 Received: from unknown (HELO ptb-spamcore01.plus.net) (192.168.71.1) by ptb-mailstore01.plus.net with SMTP; 9 Jul 2004 10:28:42 -0000 Received: from [192.168.67.3] (helo=ptb-mxcore03.plus.net) by ptb-spamcore01.plus.net with esmtp (Exim 4.32; FreeBSD) id 1Biscu-000NIV-3s for dave@picks.force9.co.uk; Fri, 09 Jul 2004 11:29:08 +0100 Received: from post.thorcom.com ([193.82.116.20]) by ptb-mxcore03.plus.net with esmtp (Exim) id 1BiscS-0000WJ-Kh for dave@picks.force9.co.uk; Fri, 09 Jul 2004 11:28:40 +0100 Received: from majordom by post.thorcom.com with local (Exim 4.14) id 1Bisbs-0003au-B6 for rs_out_1@blacksheep.org; Fri, 09 Jul 2004 11:28:04 +0100 Received: from [213.232.95.59] (helo=relay.salmark.net) by post.thorcom.com with esmtp (Exim 4.14) id 1Bisbr-0003al-9S for rsgb_lf_group@blacksheep.org; Fri, 09 Jul 2004 11:28:03 +0100 Received: from rwcrmhc11.comcast.net ([204.127.198.35]) by relay.salmark.net with esmtp (Exim 4.24) id 1BizBy-0005ed-M9 for rsgb_lf_group@blacksheep.org; Fri, 09 Jul 2004 18:29:46 +0100 Received: from jayterminal (c-67-165-6-48.client.comcast.net[67.165.6.48]) by comcast.net (rwcrmhc11) with SMTP id <2004070910273901300j355re>; Fri, 9 Jul 2004 10:27:50 +0000 Message-ID: <001f01c4659e$3f65f0a0$6501a8c0@attbi.com> From: "Jay Rusgrove" To: rsgb_lf_group@blacksheep.org References: <01C46590.89F27200.actalbot@southsurf.com> Date: Fri, 9 Jul 2004 06:19:30 -0400 MIME-Version: 1.0 X-Priority: 3 X-MSMail-Priority: Normal X-Mailer: Microsoft Outlook Express 6.00.2800.1158 X-MimeOLE: Produced By Microsoft MimeOLE V6.00.2800.1165 X-Spam-Score: 0.1 (/) X-Spam-Report: autolearn=no,RCVD_IN_SORBS=0.1 Subject: LF: Re: RE: Re: Tin Plating compound (off topic LF, almost on topic microwaves) Content-Type: text/plain; charset=iso-8859-1; format=flowed Content-Transfer-Encoding: 8bit X-Spam-Checker-Version: SpamAssassin 2.63 (2004-01-11) on post.thorcom.com X-Spam-Status: No, hits=0.0 required=5.0 tests=none autolearn=no version=2.63 X-SA-Exim-Scanned: Yes Sender: owner-rsgb_lf_group@blacksheep.org Precedence: bulk Reply-To: rsgb_lf_group@blacksheep.org X-Listname: rsgb_lf_group X-SA-Exim-Rcpt-To: rs_out_1@blacksheep.org X-SA-Exim-Scanned: No; SAEximRunCond expanded to false X-Spam-Filtered: by PlusNet SpamCORE (v3.00) Andy As an FYI... Kepro, a US company that is in the small batch - at home pc board business, used to sell (and may still) an immersion tin plate solution. While the plating soldered well and looked shiny initially it did deteriorate over time. After about a year it would oxidize to a very dull gray color and soldering became difficult requiring seemingly too much heat and flux during rework. It might have been possible to prevent the oxidation by spraying the board with a conformal coating once it was de fluxed - but I never tried that. What I've been doing lately is to mount the board to a nearly vertical surface and coat the board with solder using a 40-watt iron top to bottom. While I can't get the solder to flow quite as smoothly as the professional circuit board houses, it does look pretty smooth and bright once it is defluxed. It seems to hold up better than tin plate...a light spray of conformal coating would probably still be a good idea. my 2 cents...for what it's worth. Jay, W1VD ----- Original Message ----- From: "Andy" To: Sent: Friday, July 09, 2004 3:41 AM Subject: LF: RE: Re: Tin Plating compound (off topic LF, almost on topic microwaves) > Ok Thanks Alan. I'll make up a solution in that proportion and give it a try. > Being able to tin plate home made PCBs may solve the not too major problem of > them becoming oxidised and not so nice to look at a few days after construction > - though after all the joints have been made fortunately. > > I have been using the bubble etch tank for some time, in the garage then > utility room, and have seen no adverse effects from a fine FeCl3 mist - it is > the vertical sort. I only tend to do little boards, (SMT components for > everything these days, they're much easier to use). I have noticed a certain > difference in etch rate between top and bottom, but its so quick when hot and > the FeCl3 is fresh that its hardly important. > > The copper on normal PCB material is only 3.5microns, so that is quite an extra > deposition. > > Andy 'JNT > > > > > Hi Andy an old paper RS cat gives some information, though it would seem > there is no data sheet. > It says..... > Deposition rates of tin to tin 1.5 microns in the first half hour, and up to > 3 to 4 microns in 2 hours, can be achieved at an optimum room temperature. 5 > lites of solution may be made by disolving the pack (450gms) in 5 lites of > solution (note not 5 litres of water) at 50 deg C. This is enough for 2.7 sq > m of board ( I suppose they mean copper) > > I think that is probably the information you want. > > I think we used to call this "electroless tin-plate" I remember using > something like it for putting temporary electrodes on silicon slices. We > used a photo-electrolytic polishing system, the electrolyte was hydrofluoric > acid and glycerine....now there is something really nasty. > > For etching dont use a bubble etcher, they are terribly messy and distribute > a fine, almost aerosol, spray of ferric chloride everywhere, which you dont > notice for about 2 days after which clothing and furniture starts to fall > apart. If they are the vertical type they also tend to etch unevenly...top > to bottom so you have the rotate the board halfway though...messy. I prefer > a ice cream carton (they even have a little bulge in the middle of the base > to stop the board "ringing" down) with just enough fresh etch to cover the > board warmed to about 40 deg C by immersing in a bath of hot water, and > steady gentle rocking agitation..... about 5 to 7 mins a board. Tiring but > worth the effort. Once used etch kept for the more crude projects, where you > can just leave it and not worry about undercutting fine lines. > > Disposal (important these days) is easy, neutralise the used etch with > garden lime (very cheap). It is actually safe to bury then I > believe....probably good for reducing earth resistance and better for the > soil that common salt. > > Cheers de Alan G3NYK > alan.melia@btinternet.com > > ----- Original Message ----- > From: "Andy Talbot" > To: ; > Sent: 08 July 2004 18:01 > Subject: LF: Tin Plating compound (off topic LF, almost on topic microwaves) > > >